G.SKILL Releases Optimized DDR4-3800 CL14 Memory Kit for AMD Ryzen 3000 & X570 Platform
Taipei, Taiwan (31 July 2019) – G.SKILL International Enterprise Co., Ltd., the world’s leading manufacturer of extreme performance memory and gaming peripherals, is releasing a highly optimized, extremely low latency Trident Z Neo series DDR4-3800MHz CL14 RGB memory kit in 16GB (8GBx2) and 32GB (8GBx4) capacities for the AMD Ryzen 3000 series CPU and X570 chipset platform. Built with the powerful Samsung B-die component, this is the perfect DDR4 memory kit for those looking to push the limits of memory bandwidth on your new AMD Ryzen 3000 platform.
Optimized for High Frequency & Low Latency
At this point, it's well-known that memory performance with the new AMD Ryzen 3000 processor series is best when Infinity Fabric being tied to the memory clock at a 1:1 ratio. The G.SKILL R&D team is dedicated to push the performance boundaries even further and developed a high-frequency, low-latency memory kit at DDR4-3800 CL14-16-16-36 in capacity configurations of 8GBx2 and 8GBx4, reaching a superb memory bandwidth performance under the optimal 1:1 ratio.
As seen in the screenshot below, this Trident Z Neo memory kit is running at DDR4-3800 CL14-16-16-36 in 8GBx2 capacity with the AMD Ryzen 9 3900X processor and the MSI MEG X570 GODLIKE motherboard, reaching a tested memory bandwidth of 58GB/s, 56GB/s, and 58GB/s for read, write, and copy, respectively.
Complete Stability & Reliability
Like any G.SKILL memory kit, the specifications must remain fully stable under a memory stress test, as shown in the screenshots below, showing the 32GB (8GBx4) memory kit operating on an ASUS ROG CROSSHAIR VIII Formula motherboard with the AMD Ryzen 5 3600X processor and the 16GB (8GBx2) memory kit running on the MSI MEG X570 GODLIKE motherboard with the AMD Ryzen 9 3900X processor.
